ViTechnology® is a leading provider of advanced solutions that enhance the yield of electronics assembly.

From back-end semiconductor packaging through printed circuit board assembly and final test, we offer a wide range of inspection systems and thermal equipment worldwide.

Inspection systems cover  applications such as inspection of solder paste, pre-reflow and post-reflow component and joint inspection in SMT assembly lines.

Thermal equipment include ovens for applications such as reflow soldering, curing, wafer bumping or flip chip.

All ViTechnology® systems are lead-free compatible.