With the increasing need for automated glue dispensing, required for placement of sensors (accelerometers, gyroscopes…) or heavy components, it’s becoming crucial to also inspect glue deposits.
However inspecting glue may require external and costly equipement, and may significantly impact production cycle time.
PI Series is capable to simultaneously inspect solder paste and glue without jeopardizing cycle time.
With supervised machine learning, the glue inspection is independent from colour and dispensed material.
In addition, PI Series instantaneously confirms if correct tips and needles have been selected by operator for the dispensing machine.
Verifying glue presence/absence, location and area is now so fast and simple…