Discover How Vi TECHNOLOGY Can Improve Your SMT Production Line Performance at the 2017 Innovations Forum

Fri / 01 / 2017,

Saint-Egrève, France, January 2017 — Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will participate in the Innovations Forum 2017 – Leaders Conference, scheduled to take place March 9, 2017 in Boeblingen, Germany. Vi TECHNOLOGY company representatives will discuss how the company has coupled its 5K3D AOI with the PI Series 3D SPI and SIGMA Link to create a complete inspection solution for smart factories.

The Innovations Forum drives innovative technology development by connecting academia, industry and policy makers. Always at the forefront of new technologies for the SMT industry, Vi TECHNOLOGY is always innovating to set new standards in inspection and provide smart solutions to the SMT industry.

 Vi TECHNOLOGY’s innovative process improvement software, SIGMA Link, coupled with two high performance systems, from the PI Series (3D SPI) and K Series3D (3D AOI) products families, drive PCBA process control in new ways that have never been offered before. A new era in process control begins. The result is one integrated solution for automated optical inspection, with a live link between systems and smart interface to really improve your SMT process and productivity.

For Smart Factories, SIGMA Link is the essential element to combine all inspection data and transform them into valuable information for the users. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yields to new levels, especially important for the automotive, aerospace and defense sectors.