Vi TECHNOLOGY Makes a Big Presence at NEPCON South China with Inspection Solutions in Three Booths

Vi TECHNOLOGY Makes a Big Presence at NEPCON South China with Inspection Solutions in Three Booths

Wed / 07 / 2017,

Saint-Egrève, France, July 2017 — Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The company will exhibit with three of its manufacturers’ representatives – WKK (Stand 1J65), AmericanTec (Stand 1G65) and First Tech (Stand 1H65). Vi TECHNOLOGY will display its 5K3D AOI and 8K 3D AOI systems coupled with the PI Series 3D SPI.

The new 5K3D is a 100 percent 3D AOI based on laser technology with angled cameras. This new patented 3D AOI combination offers complete defect coverage with high precision metrology.  The awarded PI Series 3D SPI offers new horizons with programming-free software and unprecedented accuracy for small pads. These two measurement systems are the prerequisite for actionable data and process control.

The PI Series has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems. With 360° Moiré technology, the PI Series offers a unique extra-large 3D image for unprecedented review interface and outstanding accuracy. PI is the only inspection system to program automatically.

Vi TECHNOLOGY’s innovative process improvement software, SIGMA Link, coupled with two high performance systems from the PI Series (3D SPI) and K Series3D (3D AOI) product families, introduces a new era in process control. The result is one integrated solution for automated optical inspection, with a live link between systems and smart interface to improve your SMT process and productivity.