At Productronica, Vi TECHNOLOGY exhibits the new NEO platform for the K series 3D AOI. The new design embeds a machine learning based technology that drastically reduces the programming time while maintaining the high level of performance and flexibility for which it is renowned.

The machine has been redesigned to better reflect the quality and innovation of the technologies it incorporates, clearly affirming its belonging to Mycronic’s MYPro Line concept designed to enable the smart factory.
2x faster programming
Based on a customer-centric approach, the goal is to optimize the return on investment of the inspection equipment by reducing total cost of operation and by increasing the value created for the customers. This has led to innovative solutions accelerating the programming time by a factor of 2.
Machine Learning inside
New algorithms based on Machine Learning technology, a subset of Artificial Intelligence, aim at automating programming tasks through autonomous component recognition and assisted model creation. In practice, it will only take a few clicks to program the inspection of a completely new board containing hundreds or thousands of components.
Unrivalled reliability and flexibility
By combining its latest high-speed laser 3D scanning head with the new smart scene analysis algorithm, the inspection time is up to 50% faster than on previous generation. The test coverage has been extended with the detection of foreign materials, a component overhang test according to IPC requirements, and a new powerful optical character verification algorithm. These new features complement a toolbox already popular for its efficiency and versatility, such as the inspection of odd-shaped exotic components, like custom connectors, or the advanced metrological tool for distance measurement with micrometer precision.

To get a demo of the new K3D AOI platform visit Mycronic’s booth, hall A3 #341.

The new software features will be available from Q1 2020, also available as upgrades for current K series models. The NEO hardware platform will be commercially available from Q3 2020.