SMT and Semiconductor AOI Applications

SMT applications

Vi TECHNOLOGY has always followed a versatile design strategy in its product platform to offer the best return on investment regardless of your AOI strategy. Our AOI systems can therefore be implemented in several different ways, either in-line or off-line:  

• To inspect production batches Post-Reflow (or even post wave) off-line and guarantee the delivered quality of low-volume high-mix production or prototypes before electrical tests
• To inspect Post-Reflow in-line  as most of the industry is doing today
• The new trend, no longer reserved for mass producers, is to use AOI Pre-Reflow to ensure the best possible feedback on the Pick&Place process, to detect process deviations and thus enable defect prevention.
• PCBA design or production defect spectrum is also leading towards Post-Print use to detect shifts in print parameters and trigger stencil cleaning. Increasing component miniaturization (down to 01005) is pushing for 3D solder paste inspection, since volume deposit has become critical.
• Advanced strategies, such as Mixed Mode, generally combine the ability to perform Solder Paste inspection on ICs and Pre-Reflow passive component inspection in the same run. 

Vi TECHNOLOGY's integrated software suite and versatile product platform can cope with all AOI implementation strategies. AOI can be used anywhere in the line and several AOIs can even be combined to get closer to the Zero-defect Line concept. We want to ensure the versatility of our customers and to remain part of their AOI solution. Our applications experts will happy to offer relevant advice.

"Precision brings quality..."