In SMT production lines, solder paste deposits can be 100% inspected immediately after the screen printer in a timely and cost-efficient manner. The solder paste process is one of the most critical stages of the assembly line and must be controlled to guarantee final product quality. This is especially true for the placement of components such as BGAs, CSPs and 01005 chips, due to their extremely small pad size and the fact that inspection is sometimes impossible after assembly of the final product.
 

Vi TECHNOLOGY offers a wide range of inspection solutions to monitor the screen printer process: 

• 3D-SPI 
• K Series