Image Sensors and Camera Modules

Foreign materials and defects detection

With Image sensors, climbing the value range, the detection of any defect on the Sensors pixel array has become mandatory. High-end 3, 5, 8 and above MPixels sensors costs are rising, just as the new lens modules which include high-end features such as Auto-focus and which will be attached to these sensors. The sky-rocketing demand for these camera modules in the latest phones or other personal devices require a new and efficient way to ensure only Know-Good-Dies are processed on the manufacturing line, to avoid significant financial losses.

The REVEAL Imager Series AOI can detect any foreign material above 2µm in size on the pixel array or even on the whole die surface. It can also detect process defects such as striations, stain or watermarks to ensure the sensor is perfectly clean before the lens module assembly. Inspection can be performed either at the die surface, whether naked or glass-capped, or at the bottom or top side of the glass-capped TSV sensors.

Critical measurements increase lens attach process yields

The optical axis of these complex and high-end camera modules must be perfectly aligned between the sensor and the lens module in order to provide a good image quality from the final product. The REVEAL Imagers Series AOI enable this result by measuring and forward-feeding the die position data (pixel array center, rotation, tilt, epoxy thickness…) to the lens attach system, thereby significantly increasing the yield of this production system.