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IPC APEX EXPO 2012
28-Feb-2012
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Mixed Mode

In SMT production lines, the simultaneous inspection of accurate placement of chips and SOICs and solder paste deposits for fine pitch components demands that inspection systems be located before the fine pitch placement machine. With Mixed Mode Inspection, you will be able to control:

  • XYØ placement accuracy for chips and SOICs
  • 2D paste inspection for fine pitch components
  • Fine pitch paste areas for dropped chips

If the AOI machine is placed before the fine pitch placement system, it will detect wear of the placement nozzle or feeder problems, thereby enabling targeted maintenance of the high-speed chip placement machine as well as tracking of the root causes of any defects detected.


Vi TECHNOLOGY offers a wide range of inspection solutions that can be installed after high-speed chip placement systems without slowing down the assembly line: