Pre-Reflow | Applications Vi TECHNOLOGY
 

Applications
You are here: Home page > Applications > Pre-Reflow
  


events
NEPCON SHENZHEN
27-Aug-2013
PRODUCTRONICA
12-Nov-2013
A2.417

View all ›

  
Pre-Reflow

To inspect the accurate placement of chips, SOICs, fine pitch and BGA components, the inspection system must be placed before the reflow process, enabling inspection of:

  • XYØ placement of chips and SOIC
  • XYØ placement of fine pitch, BGA, CSP and Flip Chip components
  • Pre-reflow errors such as missing, mislocated or misaligned components
  • Specific components, OCV or OCR, if required
Vi TECHNOLOGY offers a wide range of inspection solutions to monitor placement accuracy: