The AOI can be placed after the reflow process to enable checking of final product quality. Defects such as tombstones may be generated during the reflow process and placing the AOI at the end of the assembly line is the only solution for detecting them. Placing the AOI after the reflow oven enables inspection of:

• Component location, misplacement, tombstones
• Solder joint defects and defective dry joints & bridges
• Bent and lifted leads

 Vi TECHNOLOGY offers a wide range of inspection solutions that can be placed Post-Reflow:

• The K Series, which can be upgraded to meet your current and future requirements, including 01005 inspection
• The patented Profiler^® tool is available as an option on all AOI systems to optimize Post-Reflow inspection