Technology leadership | Company Vi TECHNOLOGY
 

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IPC APEX EXPO 2012
28-Feb-2012
2749

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Technology leadership

Technology leadership
 1992 First AOI system
 1998 First flexible AOI system to inspect solder paste and components pre- & post-reflow with the first installation of the Vi-2000 in China
 2000 Vectoral Imaging development for the Vi-3000
 2002 Pioneer in the Closed-loop control concept with the first Zero-defect production line for Vertu & Fuji
 2003 Launch of the market's most accurate AOI system, the Vi-5000 
 2004 SMT Vision Award for Zero-defect line, development of the new Profiler® tool for solder joint analysis
 2005 Creation of upgradeable AOI solution with the 3K Series, the first upgradeable AOI
 2006 New integrated inspection software suite with Vision2006
 2007
1K Series: the first machines to bring in-line technology to bench-top solutions

Introduction of the P Series heads for higher inspection capability

 2008
Integration of FAHP technology in 3D-SPI equipment

Introduction of the in-line 5K Series allowing large board inspection. Upgrade of the integrated Software suite with Vision2008

 2009




2010

EM Asia Innovation Award for the 3D-SPI solution
REVEAL MEMS Series AOI for back-end MEMS inspection
7K Series Dual-lane AOI. Introduction of Vision2009
Selective 3D AOI technology

Frost & Sullivan rewards Vi TECHNOLOGY with the 2009 North American AOI Equipment Customer Value Enhancement Award