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SMT/HYBRID/PACKAGING 2010
SMT/HYBRID/PACKAGING 2010

Dates: 2010, June 08 – 2010, June 10
Place: Messezentrum Nuremberg
Stand: Fraunhofer Institut Stand Production line "Futur 2010" booth 6-430 - SmartTec booth 7-219

For more information, you can visit:
www.mesago.de/en/SMT/main.htmNew window
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Hosted by Fraunhofer Institut Stand Production line "Futur 2010",  Booth 6-430
Represented by our Agent SmartTec, Booth 7-219


SMT/HYBRID/PACKAGING 2010 - Europe's no.1 special interest event for system integration in micro electronics!

Traditionally, SMT/HYBRID/PACKAGING forms the ideal platform for the industry's leading companies. Among other things, the show presents the latest trends and developments as well as up-to-date solutions. With foreign companies accounting for 33% of the exhibitors, the event offers not only a wide, but also an international spectrum. And you too can benefit from the success of this well-established event! The highly qualified audience from over 50 countries rated the exhibition extremely positively.

From design and development to PCB production, components, packaging and test systems - SMT/HYBRID/PACKAGING offers a comprehensive and compact presentation of products all under one roof!