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IPC APEX EXPO 2012
28-Feb-2012
2749

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The Mobile electronic devices industry has faced several challenges with chip miniaturization and integration as well as processes productivity needs. While components are designed with a smaller footprint, end-user products contain an increasing number of components in a smaller area. At the same time, final users adopt new technologies and products faster than ever, resulting in rapid market growth from prototype to mass-production phases.

Since the introduction in 1997 of its first AOI product introduction aimed at the mobile phone industry, Vi TECHNOLOGY has continued to increase its R&D to provide innovative solutions to meet these challenges.
Vi TECHNOLOGY was the first AOI company to be qualified on 0201 or 01005 packages and is working in partnership with Pick & Place manufacturers to anticipate future process challenges.
Today, Vi TECHNOLOGY's product range and software solutions make it a world-wide, comprehensive and reliable partner:
  • 3D-SPI solution to control actual solder paste volume on 0201s, BGAs or mBGAs
  • AOI solutions combining accuracy and speed to control placement and feedback to pick&place systems with Mixed Mode and Pre-Reflow strategies
  • Post-Reflow solutions to qualify products
  • Commitment to improving the productivity per footprint ratio