Telecom Infrastructure & Networking | Segments Vi TECHNOLOGY
 

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SMT Nuremberg
16-Apr-2013
6-434 & 7-219

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Over the past 50 years, the Telecommunication Infrastructure & Networking industries sector has encountered the most impressive changes in terms of technology evolution.

The products in these fields feature the largest PCBA size available in our industry, integrating thousands of functions using state-of-the-art electronic components. The value of each board can therefore easily reach the price of a car. In such contexts, the cost of non-quality can jeopardize product line profitability. Improving control of the manufacturing process to prevent defects is a key issue.
To satisfy these requirements, the Telecommunications industry has implemented various strategies to avoid risk in the manufacturing process (cost of scrapped boards) and to ensure high quality standards to minimize defective products in the field.
Vi TECHNOLOGY has been aware of the specific challenges facing these demanding industries for many years. We supply systems with large board capabilities to inspect products and improve the manufacturing process by detecting defects at the stage of the process where cost is lowest:
  • Solder Paste Inspection to insure quality deposits under BGA
  • Process control through very accurate AOI to check component placement and joint quality
  • Back Plane Inspection (BPI) and Connector Inspection to verify the integrity of all connector pins

To simplify learning by experience, the Vi TECHNOLOGY® portfolio includes software tools and a database to allow product traceability and quality checks.