Selective 3D AOI | Technologies Vi TECHNOLOGY
 

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IPC APEX EXPO 2012
28-Feb-2012
2749

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Selective 3D AOI

Vi TECHNOLOGY® Selective 3D technology paves the way to 3-dimensional AOI. This feature allows detection of coplanarity defects on surface mount components and makes multiple camera systems unnecessary. This option enables accurate, repeatable tilt and coplanarity measurements on ICs, connectors and passive components during PCBA inspection, without affecting cycle time. It is used for all applications, but mainly expensive, high-reliability end-user applications such as the Automotive, Industrial and Infrastructure market segments, where defects must be identified. The problem is that many of these defects remain invisible to electrical tests and require additional and costly process steps to eliminate them from the production line. Having this capability within the AOI enables significant savings and a fast return on investment.

Vi TECHNOLOGY® Selective 3D AOI technology is available on new machines or as an upgrade for 3K and 5K platforms already in use. Cycle time impact is minimized: only an additional 200ms processing time per field of view which is a major improvement over less-efficient competitor systems. Our structured lighting-based approach offers a high level of efficiency even on specular objects such as “mirror” BGAs and warped surfaces.
 
Reliable and easy to use
  • Detection of components underneath BGAs, such as 01005 (0.175mm height)
  • Defect detection: 100% repeatability with no false calls
  • On-demand 3D processing for components in the library
Speed
  • One picture dedicated to 3D measurement
  • Only an extra ~200ms processing time per image
  • On-demand measurement
  
Vi TECHNOLOGY is leading the way to extended 3D Automated Optical Inspection and measurement on assembled PCBs.