News Vi TECHNOLOGY http://www.vitechnology.com/rep-edito.html 30 http://www.vitechnology.com//rep-edito/ido-50/130211_pr_efy_india.html Vi TECHNOLOGY 2K Spectro to be demonstrated live at “Live SMT LINE” at EFY EXPO13, New Dehli

Saint-Egrève, France, February 12, 2013 - Vi TECHNOLOGY will participate at the Electronics For You EXPO 2013 in Pragati Maidan,New Delhi from February 21st to 23rd. This year, EFY Expo13 has setup an assembly line to demonstrate SMT equipment capabilities. As part of this new opportunity, Vi TECHNOLOGY is proud to demonstrate its new 2K Spectro. The 2K Spectro will perform post-reflow and visitors will be able to appreciate the quality of the inspection at “Live SMT LINE” (booth N50). Attendees will be able to see optimum test coverage as well as “best in class” low false calls rate and cycle time. “Being able to perform live provides visitors a very good opportunity to understand AOI equipment in ‘real life’ and show them a complete configuration” said Rakesh Shetty, Business Development Manager for India. This is particularly true for users who have not been exposed to AOI.

Vi TECHNOLOGY 2K Spectro, with its effective footprint for PCB size not exceeding 14”x14”, is the smallest system of the Vi TECHNOLOGY K-Series. The K-Series systems offering is completed by 5K Spectro, a flexible solution for High mix Low volume with 21”x24” capabilities, the 7KDL, a dual lane solution for high volume manufacturing, and the 9K HB, with 40”x24” board size capability for niche applications.

Vi TECHNOLOGY SPECTRO heads use state of the art 8MP, 12 bit color camera to enhance the quality of the pictures with lower resolution and higher definition (thanks to the 12 bits which carries 8 times more information). This new technology brings benefits to every stage of AOI usage including higher efficiency with effective cycle time, faster programming, and friendlier intuitive interface on defect review.

Vi TECHNOLOGY has been in the AOI business for over 20 years and has built its reputation on reliable, efficient products and support excellence. Vi TECHNOLOGY’s history and reputation is important to the Indian market and was a key driver to establishing a direct presence in India for the past 5 years. The Indian Electronic market has grown gradually and numbers of local companies have emerged setting up new facilities. Vi TECHNOLOGY’s presence at the EFY EXPO13 is a natural bridge with existing and potential customers.
]]> Wed, 13 Feb 2013 15:29:35 http://www.vitechnology.com//rep-edito/ido-49/vi_technology_demonstrates_k_series_spectro_and_sigma_link_at_apex_2013.html Vi TECHNOLOGY demonstrates K-Series SPECTRO and Sigma Link at APEX 2013

Saint-Egreve, France, 2013, February 1st —Vi TECHNOLOGY demonstrates solutions to reduce defective PCBAs at APEX 2013 at San Diego from February 19 to 21, Booth 2701.

Vi TECHNOLOGY K-Series provides a wide range of AOI equipment, suitable to inspect a wide range of applications, from post print through to post wave, from small boards to very large and heavy boards, including dual-lane applications. The 2K, with its reduced foot print and best-in-class cycle time is towel suited for the high volume manufacturing for consumer products. With its wider conveyor, 5K offers the flexibility needed in high-mix low-volume environment with large variation of product size. Combining this flexibility to very low cost of ownership makes the 5K the best seller to contract manufacturer (CM). With dual-lane conveyor, the 7KDL is the perfect match for high end, high volume production lines seeking high productivity. “2012 was a tremendous year for 7KDL with numerous large orders in China, especially for mobile phones applications” said Jean-Marc Peallat, President & CEO of Vi TECHNOLOGY, Americas. Finally, givens its conveyor designed for very large and heavy boards (up to 40” x 24”), the 9KHB offers the same state-of-the-art technology of the above platforms for niche applications. Vi TECHNOLOGY will demonstrate 2K and 5K at APEX show.

Launched successfully about one year ago, the Vi TECHNOLOGY SPECTRO head, which employs a 8MP 12 bits color camera, was widely and rapidly adopted by users. The SPECTRO Technology is available on all our K-series equipment. Among the benefits, users mention superior image quality (with 12bits, the pictures support 8 times more information than classic 8 bits cameras), faster inspection and faster programming time. “This technology coupled with our legendary algorithm based software offers the most efficient AOI solution in the market with very low false calls and 100% detection” added Jean-Marc Peallat.

At APEX 2013, Vi TECHNOLOGY will demonstrate, for the first time, its new software platform: Sigma Link. This solution centralizes all the data needed for programming or generated by the inspection machines in the line. Operators can create new programs, reviews and analyze inspection data of multiple machines from the same station. Web based, Sigma Link provides the ability to access data from anywhere and at anytime. Designed to manage several user profiles, Sigma Link is the perfect tool for anyone involved in manufacturing, from operators, programmers to process engineers or quality manager.
]]> Mon, 11 Feb 2013 16:39:46 http://www.vitechnology.com//rep-edito/ido-48/huawei_technologies_co_ltd_selects_vi_technology_aos_aoi_solutions_.html
Huawei is a market leader in telecom network, devices and cloud computing. Its clientele include more than 30% of the world’s population in some 140 countries, via 45 of the world's top 50 telecom providers.

Data transfer security and continuity are key drivers in this market, requiring manufacturers such as Huawei to adhere to the highest quality standards. A defective PCB can interrupt Internet access to hundreds of thousands. Aiming for a zero defect strategy, Huawei made Vi TECHNOLOGY’s AOI systems its choice for eliminating defective PCBs. Renowned as the performance leader for defect detection and cycle time reduction, 5K PERFORM and 7KDL PERFORM met all of Huawei’s stringent specifications in the AOI selection process.

Installation of Vi TECHNOLOGY’s first AOI system at Huawei marks the beginning in a series of cooperative ventures between the two companies.

Vi TECHNOLOGY CEO François AMBLARD, said, “Working with customers with high expectations like Huawei has always been a great challenge for our company, leading to innovation in many different ways to meet their needs. Vi TECHNOLOGY has been the AOI partner of worldwide leaders in PCB manufacturing for years, and we welcome this new partner, Huawei, to our growing family of AOI users.”

Globally, Vi TECHNOLOGY ranks among the TOP 3 AOI providers. Its innovative product line combined with a world-class support team establishes Vi TECHNOLOGY as the preferred partner of international electronics manufacturing leaders such as Huawei. The partnership with Huawei is another milestone in Vi TECHNOLOGY’s Asian market growth plan.

The 5K PERFORM offers flexibility, handling large board applications while providing the latest of Vi TECHNOLOGY innovations, including Selective 3D technology for accurate coplanarity measurement of BGAs, QFNs, connectors and passive components. Innovative and modular in concept, the 5K Series allows users of entry-level or mid-range AOI systems to upgrade on-site to a platform that meets future AOI requirements. Equipped with Vi TECHNOLOGY PERFORM P-Series heads, the 5K offers great versatility and has been designed with best-in-class hardware and software technologies to provide accuracy, repeatability and fast cycle time.
The 7K Dual Lane Series offers large-board capabilities up to 21’’ x 11’’ for each of the two lanes. The multi-segment dual-lane conveyors respond to floor-space constraints as well as AOI productivity concerns to meet customer expectations regarding cost/quality optimization. The 7K DL Series benefits from all our latest innovations and also provides enhanced color viewing on the DefectViewer station to facilitate operator repair jobs.
]]> Tue, 28 Aug 2012 10:26:10 http://www.vitechnology.com//rep-edito/ido-39/vi_technology_introduces_vision_20_to_meet_today_aos_industry_challenge_nepcon_south_china_2011.html Vision 20, the latest Vi TECHNOLOGY’s software suite, to meet today’s industry challenge at NEPCON South China from August 30 to September 1. WKK at booth 1F10 will demonstrate Vision 20 and Selective Super-resolution technology based on 7K DL. 5K PERFORM will be presented in American Tec at booth 1F50.

Vision 20 offers the most comprehensive software capability for the SMT production environment. Vision 20 offers stable, consistent and repeatable inspection performance at each process step from 2DSPI through pre-reflow to post reflow and post wave application. Vision 20 algorithms provide extensive defect detection capability to ensure no missed defects, whilst minimising false calls. New software tools focus on ease of use and fast programming providing maximum efficiency in low volume high mix production facilities. Fully networked offline programming capability including program tuning, minimises downtime and further maximising production efficiency.

Vision 20 customer will qualify for our new “Free software upgrades for life” program. This program ensure that you benefit from over 20 year experience and our continuing development ensuring that you always have the most up to date inspection tools available. Please contact your Vi TECHNOLOGY sales representative for more information and access conditions to the program.

Vi TECHNOLOGY® Selective Super-resolution (SSR) technology further expands our P Series capabilities. Utilizing a well proven technology to provide high-resolution images, SSR provides enhanced capability for 01005 inspection with a minimised impact on programming time. SSR will be accessible to our customers with a Vision 20 software suite and a simple PC upgrade. Combined with our Vi TECHNOLOGY® Vectoral Imaging subpixel technology, it brings the most out of our customers’ AOI solution. SSR has been proven in mass production and offers unprecedented repeatability for customers qualifying and monitoring their 01005 design rules and manufacturing processes.]]> Fri, 19 Aug 2011 11:48:45 http://www.vitechnology.com//rep-edito/ido-38/vi_technology_americas_appoints_russell_claybrook_as_regional_sales_manager.html
RIchardson, TX, 2011, August 15th - Vi TECHNOLOGY is proud to announce the appointment of Russell Claybrook as Regional Sales Manager, effective now.

Jean-Marc Peallat, CEO of Vi TECHNOLOGY Americas, has appointed Russell to manage Vi TECHNOLOGY sales activities in the Southwestern United States covering Louisiana to California.
" The past 3 years, Vi TECHNOLOGY Americas has reinforced its Sales and Applications teams to support its double-digit growth in the region. Today, having Russell on board is a key addition to sustain our development, especially in the southern part of the country”, said Jean-Marc Peallat, President & CEO of Vi TECHNOLOGY Americas, “Russell’s SMT and semiconductor experience combined with our state of the art product portfolio will bring Vi TECHNOLOGY to the next level.”

Helping people solve manufacturing problems while managing a sales territory is not new to Russell.  As a manufacturer’s representative, he has worked with SMT and semiconductor companies across the Southwest for 20 years, supporting manufacturing engineers on process automation and quality improvement projects that achieved fast ROI.  Coupling Vi TECHNOLOGY’s powerful product line with his knowledge of board/package level defects, Russell will offer valuable hardware and software solutions to all manufacturers seeking high yield at lower cost.  

“Joining the Vi TECHNOLOGY team is a perfect fit for me.  I am very excited to be aboard and look forward to providing our customers with the best in automated optical inspection,” he said. ]]> Thu, 18 Aug 2011 19:21:47 http://www.vitechnology.com//rep-edito/ido-30/vi_technology_s_aoi_pin_through_hole_inspection_capability.html Saint Egreve, France 2010, July 12^th - 
Vi TECHNOLOGY's  AOI, Pin Through Hole inspection capability
Surface Mount Technology (SMT) has widely replaced Through Hole Technology (THT), allowing smaller assembly sizes due to, thinner boards, finer pitches and smaller size components, also setting quality and product life are to a higher standard.

Although production habits and rules have changed, providing higher quality and productivity, Pin Through Hole (PTH) component use is still necessary in specific applications because of a higher resistance to mechanical stress and vibration. This is especially the case in the Automotive, Avionics and Medical industries, where the environment for the final product is very stressful due to vibration and, temperature change, combined with demands for high integrity and long product life time, longer than 10 years. such applications as these, process evolution to SMT is particularly slow and must be submitted to long qualification processes.
The THT process is therefore still recognized as a must have, to ensure quality, reliability and long life products.

Vi TECHNOLOGY has full solutions to inspect Pin Through Holes, as a single test or part of a mixed mode SMT/THT process at line speed. Allowing 100% defect detection and ergonomic review of the defect for the operator.
Our comprehensive Vision Software Suite combined with our high quality telecentric lens offers a high defect coverage including: pin presence, fillet coverage, wetting and partial lack of solder, total lack of solder, bridges, bent pins and micro solder-balls down to 100µm.
Our illumination system, i-LITE, combines axial and circular lighting, making the inspection of PTH compliant with the IPC-610 standard.

Full traceability, accurate and reproducible inspection results together with an intuitive defect review are all the benefits you will get with our systems, for an increase of product quality, productivity and fast Return On Investment.

 ]]> Mon, 12 Jul 2010 17:20:01 http://www.vitechnology.com//rep-edito/ido-27/vi_technology_launches_the_reveal_imager_aoi_series_a_breakthrough_inspection_solution_for_the_camera_modules_manufacturing_industry_at_semicon_west.html Saint-Egrève, France, 2010, May 28^th - Vi TECHNOLOGY introduces the REVEAL Imager Series, at SEMICON West 2010 from July 13^th to 15^th, Booth 5377 - North Hall – San Francisco Moscone Center. Along with the product an automatic JEDEC Tray loader compatible with both REVEAL Imager and REVEAL MEMS Series will be demonstrated.

The REVEAL Imager Series is an Automated Optical Inspection system for the semiconductor industry which drastically decreases assembly costs and improves the quality levels of Image Sensors and camera modules manufacturing assembly in Back End Of the Line environments. This versatile AOI provides best automated inspection capabilities for foreign materials and process defects thereby selecting only the know-good-dies and exact positioning of the sensor to significantly improve the lens-attach process yields. With a high flexibility and best automated inspection capabilities at production speed, the REVEAL Imager Series is a major contributor to assembly costs savings and provides a competitive edge to customers;

Designed with a robust and field-proven granite-based gantry for absolute stability, REVEAL Imager Series features high-accuracy axes. The Vi TECHNOLOGY^® REVEAL product line high-end optical acquisition system with a sub-micron pixel size. It accurately detects any foreign material sized above 1-2µm, and checks for process defects such as striations, stain, or watermarks, etc... This AOI solution ensures a perfect cleanliness of the Image sensor before its assembly with the lens module and detects these defects on naked sensors or glass-capped TSV sensors. The inspection can be made at the pixel level or at the top or bottom sides of the capping glass material for maximum quality. At the same time, it can measure and forward-feed the exact sensor and pixel array positioning (array center X, Y; sensor rotation and tilt) to the lens attach system, to perfectly align the sensor and lens module optical axes. This feature set is a significant contributor to the lens-attach process yield improvement.

The REVEAL Imager Series optimizes the costs related to assembled materials (modules) and process steps (lens attach, final test, quality control…) by applying them to “known-good-dies” only. The automated optical inspection accuracy and repeatability levels allow an efficient replacement and improvement over manual inspection.

“The Camera modules packaging industry is currently under very high cost pressure. Components – sensors and lenses - become more and more complex and expensive, and every additional yield point significantly decreases skyrocketing scrap costs. To sustain the high-volume production of such high-end sensors, new ways of performing optical inspection become mandatory”, said Jean-Yves Gomez, CEO of Vi TECHNOLOGY.

“By combining high inspection accuracy for micron-level defect detection and high production throughput, Vi TECHNOLOGY^®‘s REVEAL Imager Series provide a flexible and breakthrough solution to this packaging processes. The first on-site trials have demonstrated the capability and the huge cost savings generated by this inspection process. With a Return on Investment that can be as fast as one to three months, there is no wonder this product has already received such a great welcome in the industry”, he added.

The REVEAL Imager system is a turnkey solution allowing either a standalone or an integrated in-line use with customized handling equipment. It can therefore be adapted to any products type and size as well as any carriers’ kind such as stiffeners, PCBs or strips… Proposed with a factory-backed extended portfolio of warranty, support and services contracts, the REVEAL Imager AOI Series is a best-in-class solution that drastically decreases camera modules assembly costs and improves the production quality.

Vi TECHNOLOGY^® REVEAL Imager new product is the first addition to the field-proven REVEAL Series AOI already available for MEMS. It brings an unmatched benefit in terms of assembly cost savings.


]]> Fri, 11 Jun 2010 09:18:47 http://www.vitechnology.com//rep-edito/ido-25/vi_technology_is_hosted_by_fraunhofer_institut_in_the_stand_production_line_future_packaging_booth_6_430_to_demonstrate_solutions_reducing_defective.html Vi TECHNOLOGY is hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-430 to demonstrate solutions reducing defective PCBAs at SMT/HYBRID/PACKAGING 2010; as well as at SmartTech booth 7-219.

Saint-Egrève, France, 2010, May 11^th - Vi TECHNOLOGY is pleased to be hosted by Fraunhofer-Institut in the Stand Production line «Future Packaging», booth 6-43 to demonstrates its 5K Series at SMT/HYBRID/PACKAGING 2010. More VIT equipment will also be presented at our agent’s booth 7-219, SmartTech to demonstrate solutions reducing defective PCBAs.

The 5K Series, a large board solution, offers flexibility for wider board applications and benefits from all the latest Vi TECHNOLOGY^® innovations, including Selective 3D AOI technology for accurate tilt and coplanarity measurement of ICs, connectors and passive components if 3D inspection of specific parameters is required. The innovative and modular concept of the 5K Series allows companies requiring entry-level or mid-range AOI systems to upgrade their equipment on-site to meet future requirements. Machines are equipped with PERFORM or PREMIUM P-Series heads, to offer greater versatility. The series has been designed with best-in-class hardware and software technologies to provide accuracy and repeatability and a short cycle time.

Vi TECHNOLOGY^® Selective 3D technology paves the way to 3-dimensional AOI. This feature allows detection of coplanarity defects on surface mount components and makes multiple camera systems unnecessary. This option enables accurate, repeatable tilt and coplanarity measurements on ICs, connectors and passive components during PCBA inspection, without affecting cycle time. It is used for all applications, but mainly expensive, high-reliability end-user applications such as the Medical, Automotive, Industrial and Infrastructure market segments, where defects must be identified. The problem is that many of these defects remain invisible to electrical tests and require additional and costly process steps to eliminate them from the production line. Having this capability within the AOI enables significant savings and a fast return on investment. The Selective 3D AOI technology is available on new machines or as an upgrade for 3K and 5K platforms already in use.

Vision2009, the new integrated software suite, goes one step further in simplifying programming.
The new intuitive “Wizards” guide users through each step of program creation and optimization, reducing the need for advanced training. Vision2009 is based on Vi TECHNOLOGY’s modular software platform and accommodates all AOI application options including: 2D Post Print, Mixed Mode, Pre Reflow, Post Reflow, Post Wave, backplane inspection, OCV and OCR. The software suite also encompasses full offline programming capability, an optimization tool, centralized common database, cross platform program transportability, review/repair station, data mining system…
]]> Mon, 10 May 2010 22:38:23 http://www.vitechnology.com//rep-edito/ido-14/vi_technology_demonstrates_solutions_to_reduce_defective_pcbas_at_apex_2010_booth_1948.html Saint-Egrève, France, 2010, March 23^rd - Vi TECHNOLOGY demonstrates solutions to reduce defective PCBAs at APEX 2010 in Las Vegas from April 6 to 8, booth 1948.

The Vi-3D-SPC integrated SPC software is a powerful, full-featured, easy-to-use modular SPC software platform. It is fully integrated with the3D-SPI machine; data is transferred via a high speed network connection directly from the source. Inspection items are summarized in a quick-read format to allow operators and engineers to identify any patterns immediately, thus aiding short-term corrective action. The product includes an extensive range of flexible 1-click functions to generate reports for all needs.

Vi TECHNOLOGY^® Selective 3D technology paves the way to 3-dimensional AOI. This feature detects coplanarity defects on flat surface components and makes multiple camera systems unnecessary. This option enables accurate and repeatable tilt and coplanarity measurements on ICs, connectors and passive components during PCBA inspection, without affecting cycle time. It can be used for all applications, but is mainly intended for expensive, high-reliability end-user applications in the Automotive, Industrial and Infrastructure market segments, where defects must be identified. The problem is that many of these defects are invisible to electrical tests and 2D optical inspection, requiring additional and costly process steps to eliminate them from the production line. Having this capability within the AOI enables significant savings and a fast return on investment. Selective 3D AOI technology is available on new machines or as an upgrade for existing 3K and 5K platforms.

Vi TECHNOLOGY^® Super-resolution technology extends current 3K Series and 5K Series capabilities. State-of-the-art mathematical algorithms reconstruct high-resolution images from several “standard” resolution images. A Gage R&R of less than 10% is achieved systematically on 01005 packages. This technology will be made available to our existing customers as a light software and hardware upgrade. Combined with the well-known and proven Vi TECHNOLOGY^® Vectoral Imaging technology, it brings out the best of our customers’ AOI solutions. This technology will soon be deployed in our Premium AOI product which will enable selection of the Super-resolution mode when appropriate and required. Cycle time impact is therefore minimized and should be almost transparent.

Vision2009, the new integrated software suite, goes one step further in simplifying programming.
The new intuitive “Wizard” guides users through each step of the program creation and optimization process, reducing the need for advanced training. Vision2009 is based on Vi TECHNOLOGY’s modular software platform and accommodates all AOI application options including 2D Post Print, Mixed Mode, Pre-Reflow, Post-Reflow, Post-Wave, backplane inspection, OCV and OCR. The suite also includes a full off-line programming capability, an optimization tool, centralized common database, cross platform program transportability, review/repair station, data mining system, etc.
]]> Thu, 25 Mar 2010 09:29:31 http://www.vitechnology.com//rep-edito/ido-13/vi_technology_inc_signs_a_partnership_agreement_with_lewis_clarck.html  Richardson, USA, 2010, March 18^th - Vi TECHNOLOGY Inc. has announced the signature of a partnership agreement with the American-based company, Lewis & Clark, leader in selling and servicing second-hand SMT equipment.

Lewis & Clark and Vi TECHNOLOGY have signed a partnership agreement to extend their product offers. At one end, Lewis & Clark will become Vi TECHNOLOGY's Licensed Service Partner for America, serving all Vi TECHNOLOGY AOI and SPI equipment from installation and basic operations to advanced support. At the other end, Vi TECHNOLOGY will be integrating the unique Lewis & Clark experience of trading used machines as new solution for customers.

Adding Lewis & Clark as a Licensed Service Partner extends Vi TECHNOLOGY's support and service capabilities through America. The Lewis & Clark team, with an average of more than 10 years' experience in the SMT industry, is located in all strategic area, providing a local presence to Vi TECHNOLOGY customers.

“This partnership seals a long term collaboration between both companies”, explained Jean-Marc Peallat, Vi TECHNOLOGY Inc. CEO, “with the objective of improving customer proximity without compromising service quality and offering more creative solutions to our customers”.

Lewis & Clark is a leader on the used equipment market, offering a wide range of products for SMT manufacturing lines. Lewis & Clark has made its reputation by providing first class service and expertise to customers.

"Lewis & Clark is excited about the partnership with Vi TECHNOLOGY here in North America. Our goal is to give Vi TECHNOLOGYs customers timely service as well as the opportunity to trade in un-used assets toward new VIT equipment" says Frank L. Clark, Jr., President/ CEO]]> Thu, 18 Mar 2010 18:54:46 http://www.vitechnology.com//rep-edito/ido-2/a_step_further_in_simplifying_programming_with_vision2009_the_new_vi_technology_software_platform.html Saint-Egrève, France, 2009, December 7th - Vi TECHNOLOGY® launches Vision2009, the new integrated software suite, which goes one step further in simplifying programming.

A new intuitive “Wizard” guides users through each step of the program creation and optimization process, reducing the need for advanced training.
VisCAM, an intuitive graphical assistant, is available at the first step of program creation. VisCAM makes it quick and easy to set up a program and to define board layout and accurate fiducial position on a real PCB image.
Teach Assist dramatically simplifies the creation of new leaded component modules. Just a few clicks are enough to measure ICs dimensions on real images and position inspection algorithms. This tool is flexible enough to enable the creation of unusual components or connectors in a minimal amount of time. The fine-tuning phase is now optimized with the Tune Assist function that helps users to set solder joint inspection parameters. By recording production, optimum thresholds are identified to distinguish between good and bad solder joints to avoid false calls and false accepts.
The Library Live Update function of Vision2009 brings us closer to our objective to do most programming off-line. This function allows the library changes to be incorporated during production without affecting cycle time.
With Vision2009, there is no compromise between ease of use and inspection quality. Using tools like LibraryPro and the latest improvements described above, user are sure to detect the maximum number of defects with a minimum number of false calls.

Kaleido, Vi TECHNOLOGY’s latest innovative program, is an enhanced imaging technology application for displaying solder joints, providing a color view to facilitate the diagnostic of defects on the Defect Viewer station.

Vision2009 is based on Vi TECHNOLOGY’s modular software platform and accommodates all AOI application options including 2D Post Print, Mixed Mode, Pre-Reflow, Post-Reflow, Post-Wave, backplane inspection, OCV and OCR. The suite also offers a full off-line programming capability, an optimization tool, centralized common database, cross platform program transportability, review/repair station, data mining system, etc.

]]> Mon, 07 Dec 2009 16:28:17 http://www.vitechnology.com//rep-edito/ido-11/more_innovation_more_value_for_vi_technology_customers_at_productronica_booth_2_435.html  Saint-Egrève, France, 2009, November 6th – Vi TECHNOLOGY as one Productronica's long-standing partners, will be exhibiting a wide range of innovative inspection systems and software solutions for a variety of applications, such as PCB assembly, back-end semiconductor production, incoming inspection and process control. Come and meet us at the New Munich Trade Show Center from November 10 to 13, 2009 – Hall 2, Booth 435.

“In our industry the key driver is equipment performance. Performance in production means optimum production speed, maximum yield and quality improvement. In the past months of the economic slowdown, Vi TECHNOLOGY has continued to invest heavily in R&D for all product lines. This was determined to be the best response to help sustain our customers through this difficult time. Inspection speed improvement, lower false call and escape rate, improved SW and HW functionality, such as Selective 3D and the Kaleido acquisition head, help reduce the cost of ownership. These are some of the notable advances we have delivered during the past months,” says Jean-Yves Gomez, CEO.

We will be demonstrating our latest AOI solutions at Productronica:

• Selective 3D AOI technology, providing accurate tilt and coplanarity measurement of ICs, connectors and passive components
• Kaleido color view, providing an enhanced color picture on the Defect Viewer station
• The 7K Series, our multi-segment dual-lane conveyor with large board capabilities up to 21’’ x 11’’ for each of the two lanes
• The 5K Series, using the latest integrated software suite with enhanced ease of programming and defect capture
• The award-winning 3D-SPI machine

As a long-standing and leading supplier of AOI solutions, we have recently enhanced and re-organized our Service and Support offer to better reflect the company’s expertise and capabilities:

• Product evaluation with an innovative Try & Share program to evaluate products at no cost and measure real benefits
• Training with standard or customized technical training courses and hands-on practice sessions
• Programming services to optimize AOI performance and ensure fast turn-around time
• Ramp-up assistance for immediate benefits and cost savings
• Turnkey maintenance contracts for peace of mind and investment protection
• Hardware and software audits, yield enhancement best practices and expert recommendations for continuous improvements and added value
• Factory-backed extended set of warranties, support and service contracts, because the needs of each customer are different.

Improving processes, productivity and quality levels are the ultimate goals of our Support & Services teams.]]> Fri, 06 Nov 2009 18:48:00 http://www.vitechnology.com//rep-edito/ido-24/vi_technology_launches_the_reveal_series_at_semicon_taiwan_2009_booth_520_a_new_inspection_solution_for_the_semiconductor_industry.html Saint-Egrève, France, 2009, September 18 - Vi TECHNOLOGY introduces the REVEAL Series, an Automated Optical Inspection system for the semiconductor industry. This equipment will drastically decrease the ppm level of defective parts delivered to customers and reduce manufacturing costs at the same time. This versatile AOI is able to detect various sizes of foreign particles and scratches and measure die position, rotation, tilt and other parameters as required.

The REVEAL MEMS system will be demonstrated for the first time at SEMICON Taiwan 2009 from September 30 to October 2, Hall 1 Booth 520. At the same time, an innovative business model will be proposed through our “Try and Share” program. This program enables clear measurement of the equipment's benefits by allowing customers to try the machine “on-site” to evaluate it in the actual MEMS packaging assembly production environment. For an affordable rental fee, you can take the time to evaluate the benefits of quality and cost reductions before making the decision to invest in the equipment.

The Vi TECHNOLOGY^®’s REVEAL MEMS solution, based on 15 years of expertise in AOI, is an in-line thorough inspection machine for MEMS packaging processes. With high flexibility and the best automated inspection capabilities at production speed, the REVEAL MEMS Series helps to decrease assembly process costs and solve customers' mission-critical issues. REVEAL MEMS detects foreign particles and measures die structure characteristics without affecting production speed.

Designed with a robust field-proven granite-based gantry for absolute stability, the REVEAL MEMS Series features high-accuracy axes and a brand new optical acquisition system with sub-micron pixel size. It accurately detects any foreign particles larger than 3μm of any origin (silicon, alumina, organic matter from operators, etc.). It ensures that the MEMs is perfectly clean before encapsulation.

At the same time, the REVEAL MEMS Series inspects the structural integrity of the MEMS die by checking for missing or damaged beams and wires as well as positioning (X, Y and rotation) within the package.
Measurement of die tilt during the AOI process was integrated because Vi TECHNOLOGY's experts knew it was critical to MEMS sensors (such as accelerometers or gyroscopes) to fulfill the application needs.
With the REVEAL MEMS Series, the costs related to assembled materials and process steps only apply to “known-good-dice”. Accurate and repeatable automated optical inspection is an efficient alternative to costly and space-consuming manual inspection.

“Semiconductor packaging processes are currently under high cost pressure. While no compromise can be made on production quality, the volume ramp-up of best-selling MEMS devices such as inertial sensors requires new ways of performing optical inspection”, said Jean-Yves Gomez, Vi TECHNOLOGY‘s CEO.
“By combining high inspection accuracy for micron-level defect detection and high production throughput, Vi TECHNOLOGY^®‘s REVEAL Series provides a breakthrough solution to packaging processes. It enables replacement of costly and non-repeatable manual inspection. REVEAL MEMS Series help to maintain or improve production quality while reducing assembly costs, and we are seeing a great welcome for this new product in the industry”, he added.

The REVEAL MEMS equipment is a turnkey solution allowing either standalone use for small production batches or use as an integrated in-line solution with customized handling equipment. It can therefore be adapted to any product type and size as well as all kinds of carriers, including wafers, boats, trays, strips, etc. Proposed with a factory-backed extended portfolio of warranty, support and service contracts, the REVEAL MEMS AOI Series is a best-in-class solution to decrease MEMS assembly costs while significantly improving quality in the production line.

Vi TECHNOLOGY^® REVEAL new product line and technology is paving the way to new inspection capabilities for other semiconductor devices such as imagers, silicon microphones, microfluidic devices and various IC packaging processes. It brings significant benefits in terms of materials, capital cost reductions and quality improvement.

“Sustainable Inspection Technology…”

]]> Fri, 18 Sep 2009 12:47:16 http://www.vitechnology.com//rep-edito/ido-6/vi_technology_opens_the_3rd_dimension_in_aoi.html  Saint-Egrève, France, 2009, August 7th - Vi TECHNOLOGY®'s latest Selective 3D AOI technology met with sincere approval at the recent NEPCON China show in Shanghai. It was seen to offer significant value to customers who were struggling with multiple camera systems to ensure accurate and repeatable measurement of tilt and coplanarity on ICs, connectors and passive components during PCBA inspection without affecting cycle time.
It can be used for all applications but is mainly for costly and high-reliability end-user applications in the automotive, industrial and infrastructure segments, where such defects must be identified. The problem is that most of these defects are visible to electrical tests and require additional, costly process steps to eliminate them from the production line. Having this capability within the AOI is providing significant savings and a fast return on investment.

Our field Beta tests conducted in June demonstrated outstanding results in both repeatability, (height less than 3μm) and failure detection tests. We have done our utmost to make this technology available to our valued customers via a simple hardware and software retrofit to existing 3K and 5K machines. Cycle time impact is minimized: only an additional 200ms processing time per field of view which is a major improvement over less-efficient competitor systems. Our structured lighting-based approach also offers efficient performance even on specular objects such as “mirror” BGAs and warped surfaces.

Selective 3D AOI technology is available on new machines or as an upgrade for existing installed 3K and 5K platforms.
Vi TECHNOLOGY paves the way to extended 3D automatic optical inspection and measurement on assembled PCBs. Please contact your sales representative for more information.
]]> Fri, 07 Aug 2009 18:23:50 http://www.vitechnology.com//rep-edito/ido-7/em_asia_product_innovation_award_recognized_vi_technology_ads_3d_spi_equipment.html Saint-Egrève, France, 2009, July 2nd -
Vi TECHNOLOGY was honored to receive the Product Innovation Award of EM Asia at Nepcon China for its 3D SPI equipment.
EM Asia Innovation Award recognized top performing companies from the electronics manufacturing industry for achieving the highest standards in various manufacturing-related products, materials and equipment that have been introduced and offered for sale in Asia between January 1st 2008 and December 31st 2008. Selection criteria take in accounthe level of innovation, cost, speed / throughput improvements, quality contribution, ease of use, maintainability and reparability, and technology advancement.

The Vi TECHNOLOGY^® 3D SPI applies the Moiré fringe theory to measure true 3D volume of solder pastes on PCB during assembly. The 3D SPI is a complete solution with a unique 3D measurement method and Fast Absolute Height Profilometry system. It also offers full PCB absolute warp measurement and absolute height measurement of solder paste, adhesive or any other deposits.

The Vi TECHNOLOGY^® 3D SPI solution focuses at the highest level on accuracy and repeatability of all measurements with an unsurpassed ease of programming and operation. Designed for high-speed inspection, its powerful & multifunctional SPC tools with real-time feedback, flexible, immediate reports and result displays, helps you to optimize your printing process maximizing quality and yield in the production environment.]]> Thu, 02 Jul 2009 18:26:13 http://www.vitechnology.com//rep-edito/ido-9/vi_technology_appointed_authorized_distributor_inetest_technologies_in_india.html Saint-Egrève, France, May 18th –
Vi TECHNOLOGY appointed authorized distributor iNETest Technologies India Pvt. Ltd. in India for their growing range of innovative inspection equipment and software solutions; to address a wide range of applications for PCB assembly, final test and back-end semiconductor production.


Mr Soni Saran Singh, Managing Director of iNETest Technologies India Pvt. Ltd., India said:
“The Vi TECHNOLOGY agreement empowers iNETest India to provide complete Test & Inspection solutions to its customers in the dynamic Indian Market. We are committed to build Vi TECHNOLOGY as the strongest brand in India.”

Mr William Tan, Sales Director for Asia Pacific of Vi TECHNOLOGY said:
“With the addition of iNETest to Vi TECHNOLOGY distribution network in India, our in-line AOI position will be greatly strengthened in this fast moving country.”


Vi TECHNOLOGY selects iNETest as a new Sales and Service Partner to provide printed circuit board assembly (PCBA) test and inspection solutions as well as associated systems integration, maintenance and support services. The new non-exclusive new distributorship is intended to serve the Indian market and respond to increasing demands from India and reinforce VIT presence through enhanced sales and support proximity.

Vi TECHNOLOGY serves very demanding market segments including Telecoms, Consumer, Computer, Automotive, Infrastructures, Industrial and Medical, and achieves the most stringent requirements in terms of accuracy, repeatability, speed and quality.


About iNETest Technologies India Pvt. Limited
From ideas to results

“iNETest Technologies India Pvt. Limited”, is a JV between iNETest Resources Pte. Limited, [wholly owned by ELLIPSIZ Corporation – Singapore], and SOJITZ CORPORATION – Japan. iNETest Technologies India Pvt. Ltd. – is a one-stop Manufacturing & Test Solutions Service provider for electronics industry.

The word iNETest stems from “Integrated (I) Network (NET) of Test Engineers (Test).

INETest in India is established solely for providing Dedicated & Customized Sales, Service & Solutions to the Customers in the field of PCBA Test & Inspection equipment requirement, ICT FIXTURING & FUNCTIONAL TEST SOLUTIONS, IC PROGRAMMING SOLUTIONS, QUALITY & RELIABILITY SOLUTIONS, ENVIRONMENTAL TEST SOLUTIONS , SOLDERING & DESOLDERING SOLUTION, PCB ROUTING SOLUTIONS of electronics manufacturing industry.

With its head office in Chennai, iNETest has established Sales & Service offices at Bangalore, Delhi, Mumbai & Pune & Hyderabad to provide the best Sales & Service Support to the customers.

iNETest Resources also offers Vi TECHNOLOGY's inspection equipments that are used in the manufacturing plants, installation, deployment and operation of electronic equipment and systems, and communications networks and services.

Through unfailing and consistent communication with our partners and customers, iNETest will continue to provide seamless account management and service and support coverage to our customers, being relevant and of value to our customers' and partners' dynamic business environment.

More information at www.inetest.com
]]> Mon, 18 May 2009 18:34:49 http://www.vitechnology.com//rep-edito/ido-8/vi_technology_nepcon_china_2009.html Saint-Egrève, France, 2009, April 15th – As one of the regular partners of NEPCON China 2009 for several years now, Vi TECHNOLOGY exhibits a wide range of innovative inspection equipment and software solutions for a wide range of applications for PCB assembly, final test and back-end semiconductor production. Come and meet us at Shanghai Everbright Convention and Exhibition Center - East Hall, Level 1, Booth 4F10.

Since last year we have enlarged our product range which is adapted to the most demanding requirements of the market in terms of accuracy, repeatability, speed and quality. With 15 years’ experience we have the mandatory know-how in AOI for the SMT industry. We confirm our strong position in the AOI market with our proven K Series (from small to large boards & dual lane capabilities) and new software solutions with Vision 2008, including a number of new features like LibraryPro as well as our innovative 3D SPI solutions. We continuously create new solutions for our customers.

This year at Nepcon Shanghai we will demonstrate a new solution to help our customers verify in an easy, speedy way, a selective 3D measurement for pre-reflow and post-reflow applications. Implementing Vi TECHNOLOGY patented solutions here will bring a robust easy-to-use solution without implementing new equipments inside the existing manufacturing lines. This new feature is not compromising the efficiency of the traditional AOI system nor the production efficiency. We propose turn-key solutions fulfilling the needs of all market segments to maximize the Return-On-Investment and decrease the cost of ownership in the manufacturing plant. Our equipment is supported by a world-class level of service with a fast response-time and we offer a 24 hour hotline.

“Vi TECHNOLOGY introduces new business models to help our customers to benefit from the latest evolution of our equipment. In this difficult time, when a company decides to invest, it is driven by an obvious available gain in efficiency or because they have a specific need. In Vi TECHNOLOGY we put our customers in the center of our innovation decision process. Creating more value to them eases the investment decision - and optimizes their advantage.” said Jean-Yves Gomez, VIT’s CEO.]]> Wed, 15 Apr 2009 18:32:19